Journal of Adhesion Science and Technology

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
pp. 1593-1630(38)
Authors: Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung Wook; Wong, C.P.

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
pp. 1631-1657(27)
Authors: Lin, Y.C.; Chen, X.

Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
pp. 1659-1671(13)
Authors: Li, Jing; Lumpp, Janet K.; Andrews, Rodney; Jacques, David

Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
pp. 1673-1697(25)
Authors: Lin, Yung-Sen; Chiu, Sheng-Shiang

Drop Test Performance of Isotropic Electrically Conductive Adhesives
pp. 1699-1716(18)
Authors: Morris, James E.; Lee, Jeahuck

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
pp. 1717-1731(15)
Authors: Zhang, Yan; Liu, Johan; Larsson, Ragnar; Watanabe, Itsuo

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
pp. 1733-1756(24)
Authors: Haase, J.; Farley, D.; Iyer, P.; Baumgartner, P.; Dasgupta, A.; Caers, J.F.J.

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
pp. 1757-1780(24)
Authors: Farley, D.; Dasgupta, A.; Caers, J.F.J.

Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
pp. 1781-1797(17)
Authors: Zenner, Robert L.D.; Murray, Cameron T.; Fisher, Carl