ISSN 0169-4243, Online ISSN: 1568-5616
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Editorial Note pp. 1333-1333(1) Author: Mittal, Kash
Guest Editorial pp. 1335-1337(3) Authors: da Silva, Lucas F.M.; Öchsner, Andreas
Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films pp. 1339-1354(16) Authors: Kim, Jong-Woong; Lee, Young-Chul; Ko, Jae-Hoon; Nah, Wansoo; Jeong, Myung Yung; Kwon, Hyuk-Chon; Jung, Seung-Boo
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste pp. 1355-1364(10) Authors: Noh, Bo-In; Lee, Jong-Bum; Kim, Jong-Woong; Jung, Seung-Boo
A New Finite Element Formulation for Thin Non-Homogeneous Heat-Conducting Adhesive Layers pp. 1365-1378(14) Authors: Öchsner, Andreas; Mishuris, Gennady
Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application pp. 1379-1386(8) Authors: Lee, Hee-Jung; Hyun, Seungmin; Kim, Jae-Hyun; Lee, Hak-Joo; Choi, Dae-Geun; Lee, Dong-II; Jeong, Jun-Ho; Lee, Eung-Sug
Molecular Dynamics Simulation of Polymer-Metal Bonds pp. 1387-1400(14) Authors: Suérez, J.C.; Miguel, S.; Pinilla, P.; López, F.
Curing Behavior and Adhesion Performance of UV-Curable Styrene-Isoprene-Styrene-Based Pressure-Sensitive Adhesives pp. 1401-1423(23) Authors: Park, Young-Jun; Lim, Dong-Hyuk; Kim, Hyun-Joong; Joo, Hyo-Sook; Do, Hyun-Sung
Surface Modification of Low Density Polyethylene (LDPE) Film Using Corona Discharge Plasma for Technological Applications pp. 1425-1442(18) Authors: Pascual, M.; Sanchis, R.; Sánchez, L.; García, D.; Balart, R.
The Effect of Surface Modification of Silica Microfillers in an Epoxy Matrix on the Thermo-mechanical Properties pp. 1443-1459(17) Authors: Olmos, D.; Baselga, J.; Mondragon, I.; González-Benito, J.
Influence of Silanisation Parameters With γ-Methacryloxypropyltrimethoxysilane on Durability of Aluminium/Acrylic Adhesive Joints pp. 1461-1475(15) Authors: Del Real, J.C.; Cano de Santayana, M.; Abenojar, J.; Pantoja, M.; Martinez, M.A.
Parametric Study of Adhesively Bonded Single Lap Joints by the Taguchi Method pp. 1477-1494(18) Authors: da Silva, Lucas F.M.; Critchlow, G.W.; Figueiredo, M.A.V.
Peel Behaviour of Aircraft Fuel Tank Sealants: the Effect of Peel Angle, Sealant Layer Thickness and Peel Rate pp. 1495-1522(28) Authors: Giannis, S.; Adams, R.D.; Clark, L.J.; TAYLOR, M.A.
Identification of the Strain Rate Parameters for Structural Adhesives pp. 1523-1540(18) Authors: Fancello, E.; Goglio, L.; Stainier, L.; Vassoler, J.M.
On Modelling the Non-linear Behaviour of Thin Adhesive Films in Bonded Assemblies With Interface Elements pp. 1541-1563(23) Authors: Créac'hcadec, R.; Cognard, J.Y.; Heuzé, T.h.
Computational Modelling of the Residual Strength of Repaired Composite Laminates Using a Cohesive Damage Model pp. 1565-1591(27) Authors: Campilho, R.D.S.G.; de Moura, M.F.S.F.; Domingues, J.J.M.S.; Morais, J.J.L.
