Journal of Adhesion Science and Technology

Young's modulus and adhesion coefficient of amorphous Ni-P coatings on a metal substrate
pp. 1009-1019(11)
Authors: Kubisztal, M.; Kubisztal, J.; Chrobak, A.; Haneczok, G.

Deformation of bowed silicon chips due to adhesion and applied pressure
pp. 1021-1043(23)
Authors: Pamp, Andy; Adams, George G.

Analysis of substrate preparation and curing position on mechanical properties of adhesive joints using statistical methods
pp. 1045-1058(14)
Authors: Pantoja, M.; Abenojar, J.; Velasco, F.; Martínez, M.A.; Durbán, M.

The role of joint viscoelastic function in the adhesion of low-density polyethylene to thermoplastic starch
pp. 1059-1069(11)
Authors: Ghafoori, M.; Mohammadi, N.; Ghaffarian, S.R.

Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film
pp. 1071-1087(17)
Authors: Kim, Jong-Woong; Jung, Seung-Boo

Dynamics of the wetting process on dielectric barrier discharge (DBD)-treated wood surfaces
pp. 1089-1096(8)
Authors: Topala, Ionut; Dumitrascu, Nicoleta

Characterizing the mechanism of improved adhesion of modified wood plastic composite (WPC) surfaces
pp. 1097-1116(20)
Authors: Oporto, Gloria S.; Gardner, Douglas J.; Bernhardt, George; Neivandt, David J.