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Volume 20, Number 10, 2006

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Chemical modification combined with corona treatment of UHMWPE fibers and their adhesion to vinylester resin
pp. 1047-1059(13)
Authors: Zheng, Zhen; Wang, Xinling; Huang, Xiancong; Shi, Meiwu; Zhou, Guotai

A multi-scale method to investigate delamination in electronic packages
pp. 1061-1078(18)
Authors: Fan, Hai Bo; Wong, Cell K.Y.; Yuen, Matthew M.F.

A methodology for detecting interfacial debonding in clay/epoxy nanocomposites
pp. 1079-1089(11)
Authors: Kim, Jae-Hyun; Holmes, Gale A.; Snyder, Chad R.

Changes in cohesion and adhesion of tanned leather as a function of reaction time with urethane-based primer
pp. 1091-1107(17)
Authors: Vélez-Pagés, Teresa; Martín-Martínez, José Miguel

Mode-I adhesive fracture energy measurement with modified single-lap joint test geometry
pp. 1109-1124(16)
Authors: Kumar, S.B.; Sridhar, I.; Sivashanker, S.; Osiyemi, S.O.

Surface-forces-driven instability of comb-drive microcantilevers in MEMS
pp. 1125-1146(22)
Authors: Zhu, J.; Ru, C.Q.; Mioduchowski, A.

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