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Volume 19, Number 7, 2005

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Formulation and characterization of UV-light-curable electrically conductive pastes
pp. 511-523(13)
Authors: Cheng, W.T.; Chih, Y.W.; Lin, C.W.

The effect of residual strains on the progressive damage modelling of environmentally degraded adhesive joints
pp. 525-547(23)
Authors: Liljedahl, C.D.M.; Crocombe, A.D.; Wahab, M.A.; Ashcroft, I.A.

Solvent-dependent adsorption of phenolic resin onto silica substrate
pp. 549-563(15)
Authors: Wang, B.C.; Huang, Y.D.; Liu, L.

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)
pp. 565-578(14)
Authors: Chiang, Huann-Wu; Chung, Cho-Liang; Chen, Liu-Chin; Li, Yi; Wong, C.P.; Fu, Shen-Li

Effect of bond thickness on creep lifetime of adhesive joints under mode I
pp. 595-610(16)
Authors: Al-Khanbashi, Abdullah; El-Said, Ehab Mohammed

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