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Journal of Adhesion Science and Technology logo VSP, an imprint of Brill logo

Volume 18, Number 10, 2004

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The role of water in delamination in electronic packages: degradation of interfacial adhesion
pp. 1103-1121(19)
Authors: S.Y.Y. Leung; D.C.C. Lam; Shijian Luo; C.P. Wong

The influence of hydroxyl group concentration on epoxy–aluminium bond durability
pp. 1123-1152(30)
Authors: A.N. Rider; N. Brack; S. Andres; P.J. Pigram

Dimple-type failures in a polymer/roughened metal system
pp. 1153-1172(20)
Authors: Ho-Young Lee; Jianmin Qu

Polypropylene surface functionalization with chitosan
pp. 1173-1186(14)
Authors: Svetlana Bratskaya; Dmitry Marinin; Mirko Nitschke; Dieter Pleul; Simona Schwarz; Frank Simon

A study on durability of joints bonded with pressure-sensitive adhesives
pp. 1187-1198(12)
Authors: Scedilemsettin Temiz; Adnan Özel; Murat Demir Aydin

Analysis of atomic force microscopy data for deformable materials
pp. 1199-1215(17)
Authors: Mark W. Rutland; James W.G. Tyrrell; Phil Attard

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