Journal of Adhesion Science and Technology

Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
pp. 731-750(20)
Authors: Gomatam R.R.; Sancaktar E.

Development of metal-bonding spray adhesives for use in aerospace repair applications
pp. 751-764(14)
Author: Tillman M.S.

Multinuclear 1D- and 2D-NMR study of the hydrolysis and condensation of bis-1,2-(triethoxysilyl)ethane
pp. 765-778(14)
Authors: Franquet A.; Biesemans M.; Willem R.; Terryn H.; Vereecken J.

Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma
pp. 779-794(16)
Authors: Devarapalli V.K.; Li Y.; Cetinkaya C.

Non-contact removal of 60-nm latex particles from silicon wafers with laser-induced plasma
pp. 795-806(12)
Authors: Varghese I.; Cetinkaya C.

Study on the phase behavior of a toughened epoxy adhesive and its bond-strength properties at liquid nitrogen temperature
pp. 807-815(9)
Authors: Hu X.; Huang P.

The effect of carbon black and colloidal silica fillers on interfacial adhesion at polystyrene interfaces
pp. 817-831(15)
Authors: Bronner M.J.; Hu X.; Rafailovich M.; Sokolov J.; Shah A.A.; Kim H-J.; Gerspacher M.

Fracture analysis of an adhesively bonded sandwich beam under Mode-I loading
pp. 833-847(15)
Authors: Huang S-J.; Lin Y-C.